Contract Electronics Manufacturing Services

Fideltronik offers complete solution for electronics manufacturing. All required processes from SMT placement to final box build. Two manufacturing locations (Sucha Beskidzka and Cracow) guarantee production flexibility and ensure on-time deliveries in rapidly changing Customers demands.

SMT Assembly

SMT lines with modern assembly equipment capable for glue and solder paste assembly of 0402 chips /0.4mm / BGA parts.

PTH Assembly

Automatic axial, radial, jumper-wire insertion machines allows to assemble through hole components in efficient way and minimise manual assembly. Automated pin insertion machines for demanding applications like telecom systems back-planes etc.

AOI Testing

AOI test machines (Photodynamics Vision 8000) allows to monitor production process quality. On-line connection to database allows to trace test results and monitor process yields.

Manual Assembly & Wave Soldering

Number of manual assembly lines and wave soldering machines. No-clean process with environmental friendly soldering fluxes (VOC-free) with nitrogen support. Experience in soldering of high-thermal (4oz) boards. Lead-free soldering support.

ICT Testing

Number of ICT testers based on HP3070, Innovate 9200, SPEA systems. On-line connection to database allows to trace test results and monitor process yields. Fixtures and test scripts developed by own test department or transferred from Customers.

Box build & Mechanical assembly

Dedicated final assembly cells with special tools and jig to enable mistake-proof assembly process and efficient material flow.

FCT & Burn-in Testing

Functional and burn-in testing of final products. On-line connection to database allows to trace test results and monitor process yields. Custom based test equipment mostly based on LabView platform.

Fideltronik - contract elekctronics manufacturing services

Potting & Encapsulation

Experienced in potting and encapsulation with various polyurethane casting systems. Dynamic and static mixing machines and optional vacuum chamber in place to enable high quality potting & encapsulation process.